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It is possible to control the porous structure with a spiny morphology like that of a porcupine!
The bonding strength between the epoxy resin that encapsulates the semiconductor and the nano silver paste used for mounting has improved. Utilizing a large surface area, applications in electrochemical sensors are also anticipated.
Years of proven results and stable quality!
Introduced early in Japan as a lead-free measure, with over 10 years of proven results!
Compatible with high current connectors! Plating technology that possesses the inherent low volume resistivity and solid lubrication properties of silver.
Our company offers the "Graphene Composite Ag Plating" technology, which combines graphene nanoparticles with a soft silver plating film. Through the synergistic effect of the unique surface roughness of the composite plating and the graphene exposed on the friction surface, we have significantly improved low contact resistance, low friction, and anti-adhesion compared to conventional hard silver plating. 【Features】 ■ Dramatically improved low contact resistance, low friction, and anti-adhesion ■ Low electrical loss and high durability, allowing for thinner plating ■ Achieves cost-effective plating suitable for high current electrical contacts *For more details, please download the PDF or feel free to contact us.
Compatible with next-generation SiC power devices! Achieves excellent performance.
"Electroless Ag plating" is a technology from OJIC Technologies designed for next-generation SiC power devices. Conventional technologies faced issues such as instability in operation under high-temperature environments and an inability to meet the demands for higher performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long period without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.
